Kemko^® Injection

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The Kemko^® Injection Process (KIP) method of injecting cracks down to 0.002 inches wide (2 mils) for their full depth often uses a Kemko^® epoxy adhesive without the additional labor time and costs of installing plastic ports. When the injected adhesive cures, it seals the crack entirely and also restores the concrete to its original monolithic integrity. Kemko^®’s epoxy crack injection specification provides a for this process.

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Products

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Kemko^® 019 LO Temp Seal

Epoxy Adhesive for Crack Sealing or General Bonding

Kemko^® 022 Superseal

Very Fast Set Paste Adhesive for Crack Sealing

Kemko^® 026 UW IR

Epoxy Adhesive for Underwater Pressure Injection Grouting

Kemko^® 030, Hi Amb IR

High Ambient Temperature Epoxy Adhesive for Pressure Injection Grouting

Kemko^® 038 Regular IR

Structural Epoxy Adhesive for Pressure Injection

Kemko^® 046 QuickSeal

Epoxy Adhesive for Crack Sealing or General Bonding

Kemko^® 050 Slump IR

Epoxy Adhesive for Pressure Injection Slump Pump Grouting

Kemko^® 051 Lomod IR

Low Modulus Epoxy Adhesive for Pressure Injection Grouting

Kemko^® 068 LoVis IR

Ultra-Low Viscosity Epoxy Adhesive for Pressure Injection

Kemko^® 077 Large Void IR

Low Exotherm Epoxy Adhesive for Pressure Injection Grouting

Kemko^® 104 UW Putty

Long Potlife, Toughened Epoxy Putty for Underwater Bonding

Kemko^® 165, Hi Temp IR

High Temperature Epoxy Adhesive for Pressure Injection Grouting

Resources

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Brochure

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