Kemko® 026, UW IR is a two-component, low viscosity, structural, epoxy adhesive specifically designed for pressure injection grouting using KIP System automatic meter, mix and dispense application equipment. Primary uses include the structural repair of cracks and delaminations in concrete, masonry, stone and wood; filling of voids in porous and honeycombed concrete and grout; adhesive bonding of steel plates (external reinforcement); and, anchoring bolts, dowels and rebar into concrete, masonry or stone when the substrate is immersed or submerged in water. Applications requiring material thickness in excess of 1/4 inch may be facilitated by pre-placing aggregate in the void. Kemko® 026 bonds to dry, damp and wet substrates and to substrates immersed or submerged in fresh or salt water. The components do not contain volatile organic compounds (VOC’s).
The physical properties of the product allow its use in applications requiring resistance to creep and stress relaxation, maintenance of mechanical properties at high ambient temperatures and high load bearing strength. Excellent substrate wetting and water displacement properties provide adhesion and high bond strength under adverse application conditions, e.g., cold, submerged concrete. Unlike many other high modulus epoxy adhesives, Kemko® 026 cures to a tough, resilient polymer and has excellent load transfer capability. It has a convenient 2:1 (by vol.) mixing ratio and employs special colorants for contrasting component color.Technical Data Sheet