Kemko® 030, HiAmb IR is a two-component, low viscosity, structural, epoxy adhesive specifically designed for pressure injection grouting using KIP System automatic meter, mix and dispense application equipment. Primary uses include the structural repair of cracks and delaminations in concrete, masonry, stone and sealed wood; filling of voids in porous and honeycombed concrete and grout; adhesive bonding of steel plates (external reinforcement); and, anchoring bolts, dowels and rebar into concrete, masonry, or stone when the ambient air and/or substrate temperature at the time of installation is greater than approximately 90ºF. Applications requiring material thickness in excess of 1/4 inch may be facilitated by pre-placing aggregate in the void. KEMKO® 030 bonds to dry, damp and wet i.e. (free of standing water) substrates. The components do not contain volatile organic compounds (VOC’s).
The physical properties of the product allow its use in applications requiring resistance to creep and stress relaxation, maintenance of mechanical properties at high ambient temperatures, high load bearing strength and excellent adhesion under adverse application conditions, e.g., hot, humid environments. Unlike many other high modulus epoxy adhesives, KEMKO® 030 cures to a tough, resilient polymer and has excellent load transfer capability.Technical Data Sheet