Kemko® 001, LP Bonder is a liquid two-component, long pot life, structural epoxy adhesive designed for application on horizontal surfaces and in vertical, downward oriented holes. Primary uses include the structural bonding of plastic (fresh) construction materials,e.g., hardened concrete, masonry, stone, steel, and wood to themselves or each other and anchoring bolts, dowels, and rebar intovertical, downward oriented holes in concrete, masonry, or stone. The product is ideally suited for applications requiring significantmanual labor (due usually to restricted access to the substrate) and when a long cure time is not a constraint. Kemko® 001 bonds to dry and damp substrates; wet substrates must be free of standing water. The components do not contain volatile organic compounds (VOCs).
The physical properties of the product allow its use in applications requiring resistance to creep and stress relaxation, maintenance of mechanical properties at high ambient temperatures, and high-load bearing strength. Exceptional substrate wetting and water displacement properties ensure excellent adhesion under adverse application conditions, e.g., cold, wet concrete. The working life/cure time of Kemko® 001 LP Bonder may be decreased, if required, by pre-blending Part B with Part B of the short pot life liquid product, Kemko® 008, SP Bonder. Blending the mixed product with a mixed companion paste product, Kemko® 028 LP Paste, will increase the viscosity of Kemko® 001 LP Bonder. The long and short pot life and bonder and paste forms of the product (Kemko® 001, 008, 009, and 028) employ a 2:1 (by vol.) mixing ratio that must be maintained at all times.Technical Data Sheet