CCS™ Bonder Paste , Low Modulus

Toughened Epoxy Paste Adhesive for Spall Repair and Bonding


CCS™ Bonder Paste, Low Modulus is a two-component, low modulus, toughened epoxy paste adhesive designed for application on horizontal, vertical, and overhead surfaces. The low modulus and stress relaxation properties of the product allow its use in applications requiring resistance to freeze/thaw and thermal cycling and large changes in ambient temperature. Unlike other rigid epoxies, the product will withstand high levels of thermal and mechanical shock. Primary uses include the filling of spalls, cracks, gaps, and voids in and bonding of flexible materials including plastics and other elastomers to concrete, masonry, stone, and steel.


  • Convenient 2:1, by Vol. Mix Ratio
  • Low Modulus Properties for Freeze/Thaw Resistance Bonds to Dry, Damp and wet
  • Non Sag at Applied Thickness of 1/4 Inch
  • High Thermal and Mechanical Shock Resistance
  • Recommended for Bonding Flexible Materials to Rigid
  • Environmentally Safe - No VOC Solvents
Technical Data Sheet


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