Kemko® 171 SP Paste
Bonder - Short Pot Life, Structural Epoxy Adhesive Non-Sag Paste
Description
Kemko® 171 SP Paste e is a 1:1 ratio, two-component, short pot life, structural epoxy adhesive paste designed for structural and non-structural application on horizontal, vertical, and overhead concrete surfaces and for pressure injection grouting using KIP™ (KEMKO® Injection Process) System automatic meter, mix, and dispensing application equipment. Primary uses include the structural repair of cracks, external steel plate reinforcement bonding, seismic upgrade K-Bracing historical brick building, filling ruble zone in brick building, filling of voids and gaps in pre-cast concrete elements, and anchoring bolts, dowels, and rebar into concrete, masonry, or stone. Its excellent physical properties allow its use in applications requiring resistance to creep and stress relaxation, maintenance of mechanical properties at high ambient temperatures and high load bearing strength. It bonds dissimilar materials to hardened concrete, masonry, and stone. It is designed for bonding and grouting applications requiring short-set times at elevated temperatures. It also may be used as a surface seal in a pressure injection crack repair process. It bonds to dry, damp, and wet substrates; wet substrates must be free of standing water. No SiO2 (silica sand fillers are used as a low-cost filler or to control viscosity) is used in the manufacturing of KEMKO® 171. It contains no VOC’s (volatile organic compounds).
- Meets - ASTM C881, Type I, II, IV and V, Grade 3, Class B and C and AASTHO M235, Type I, II, IV and V, Grade 3, Class B and Class C
- Meets - ACI 548.15-20 Specification for Crack Repair by Epoxy Injection
- Meets - ACI 548.12-12 Specification for Bonding Hardened Concrete and Steel to Hardened Concrete
Features
KEMKO® 171 SP is a convenient 1:1 ratio, short working time structural epoxy adhesive, 1/4 inch plus non-sag paste. The physical properties of the product allow its use in applications requiring resistance to creep and stress relaxation, maintenance of mechanical properties at high ambient temperatures, and high-load bearingstrength. Exceptional substrate wetting an dwater displacement properties ensure excellent adhesion under adverse application conditions, e.g., cold, wet concrete.
- High chemical resistance.
- No sag at applied thickness of 1/4 inch, plus.
- It bonds to dry, damp, and wet substrates; wet substrates must be free of standing water.
- Environmentally safe. No VOC solvents.