Kemko® 028 LP Paste
Long Potlife Epoxy Paste Adhesive for Bonding
Description
Kemko® 028, LP Paste is a two-component, long potlife, structural; epoxy paste adhesive designed for application on verticalsurfaces and in horizontal and overhead oriented holes. Primary uses include the filling of wide cracks, gaps and voids in concreteand masonry, bonding of rigid construction materials, e.g., hardened concrete, masonry, stone, steel and sealed wood to themselves oreach other and anchoring bolts, dowels and rebar Into horizontal and overhead oriented holes in concrete, masonry or stone. Kemko® 028, LP Paste bonds to dry, damp and wet (no free standing water) substrates and can be applied up to 1/2 inch thick without sag or flow.The components do not contain volatile organic compounds (VOCs).
Features
The physical properties of the product allow its use in applications requiring resistance to creep and stress relaxation, maintenance of mechanical properties at high ambient temperatures, and high-load bearing strength. Exceptional substrate wetting and water displacement properties ensure excellent adhesion under adverse application conditions, e.g., cold, wet concrete. The working life/cure time of Kemko® 008, SP Bonder may be increased, if required, by pre-blending Part B with the Part B of the long pot life liquid product, Kemko® 001, LP Bonder. The viscosity of Kemko® 008, SP Bonder can be increased. Blending the mixed product with mixed companion paste product, Kemko® 009, SP Paste. The long and short pot life and bonder and paste forms of the product (Kemko® 001, 008, 00, and 028) employ a 2:1 (by volume) mixing ratio that must be maintained at all times.
Technical Data Sheet